Fabrication of miniaturized electron beam system

A novel electron beam lithography system, microcolumn, was designed and fabricated using a wafer stacking and double metal interconnection process. This is the first monolithic microcolumn. All electrodes were made of highly doped Si wafer and Pyrex glass was used as an insulator. The system was assembled using a glass jig and several alignment methods including a conventional method using an aligner, laser diffraction image and refracted light were used and the misalignment was less than 10μm. Anodic bonding was performed and the process condition was optimized to reduce the stress. The size of 3×3 arrayed microcolumn system including jig is 50mm × 50mm and the height is 6.5mm. The size of 1 column is 6mm × 6mm and it is the smallest size.