DocumentCode :
1719721
Title :
A unified SPICE compatible model for large and small signal envelope simulation of linear circuits excited by modulated signals
Author :
Lineykin, Simon ; Ben-Yaakov, Sam
Author_Institution :
Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
Volume :
3
fYear :
2003
Firstpage :
1205
Abstract :
The envelope simulation method, developed earlier for large signal simulation (time domain, TRAN), is extended to include small signal envelope simulation (AC) and DC sweep simulation (steady state for a range of carrier frequencies). The model is derived for AM, FM and PM modulation schemes and is demonstrated on a piezoelectric transformer circuit. The analytical derivations of the model were verified against full circuit simulations that include the high frequency carrier. Excellent agreement was found between the simulation results according to the new unified envelope model and the full simulation.
Keywords :
SPICE; amplitude modulation; circuit simulation; frequency modulation; linear network analysis; piezoelectric devices; pulse modulation; signal processing; time-varying networks; transformers; AM modulation; DC sweep simulation; FM modulation; PM modulation; TRAN; analytical model; carrier frequency range; circuit simulation; envelope simulation method; large signal envelope simulation; linear circuits; modulated signal; piezoelectric transformer circuit; small signal envelope simulation; steady state; time domain; unified SPICE compatible model; Circuit simulation; Computational modeling; Computer simulation; Electronic ballasts; Frequency modulation; Linear circuits; Power electronics; Power system modeling; SPICE; Steady-state;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialist Conference, 2003. PESC '03. 2003 IEEE 34th Annual
ISSN :
0275-9306
Print_ISBN :
0-7803-7754-0
Type :
conf
DOI :
10.1109/PESC.2003.1216619
Filename :
1216619
Link To Document :
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