DocumentCode :
172
Title :
Vacancy Cohesion-Isolation Phase Transition Upon Charge Injection and Removal in Binary Oxide-Based RRAM Filamentary-Type Switching
Author :
Kamiya, K. ; Moon Young Yang ; Magyari-Kope, B. ; Niwa, Masaaki ; Nishi, Yoshio ; Shiraishi, Kotaro
Author_Institution :
Grad. Sch. of Pure & Appl. Sci., Univ. of Tsukuba, Tsukuba, Japan
Volume :
60
Issue :
10
fYear :
2013
fDate :
Oct. 2013
Firstpage :
3400
Lastpage :
3406
Abstract :
We report on the electronic roles in filamentary-type switching of binary oxide-based resistive random access memories using ab initio calculations. We show that charge injection and removal determine the thermodynamic stability of the vacancy filament and the diffusion in the memory devices; electron injection induces the vacancy cohesion that stabilizes the filament, whereas removal of these electrons favors the vacancy isolation that destabilizes the filament; electron removal makes the energy barrier of the vacancy diffusion processes small enough to be overcome by joule heating. The vacancy cohesion-isolation processes are induced by charge injection and removal that leads to occupation of the bonding-like electron states, which can be controlled by shifting the system Fermi level via an applied voltage during memory operation. The vacancy cohesion-isolation phase transition upon charge injection and removal is thus one of the main factors that govern resistive switching. Based on the physics, we propose three-layer stack structures for further improvement of the memory characteristics.
Keywords :
ab initio calculations; charge injection; random-access storage; Fermi level; ab initio calculations; binary oxide based RRAM filamentary type switching; binary oxide based resistive random access memories; bonding like electron states; charge injection; electron injection; electronic roles; energy barrier; joule heating; memory characteristics; memory devices; memory operation; resistive switching; thermodynamic stability; three layer stack structures; vacancy cohesion isolation phase transition; vacancy cohesion isolation processes; vacancy diffusion processes; vacancy filament; voltage; Educational institutions; Energy barrier; Geometry; Heating; Physics; Process control; Switches; $Ab~initio$ modeling; charge injection and removal; resistive random access memory (RRAM); three-layer stack structure; vacancy cohesion-isolation phase transition;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2279397
Filename :
6589206
Link To Document :
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