DocumentCode :
172049
Title :
Visualization of lightning impulse current discharge on CFRP laminate
Author :
Sonehara, T. ; Kusano, H. ; Tokuoka, N. ; Hirano, Y.
Author_Institution :
Technol. Dev. Dept., Shoden Corp., Tokyo, Japan
fYear :
2014
fDate :
11-18 Oct. 2014
Firstpage :
835
Lastpage :
839
Abstract :
In this study, we performed optical visualization experiments on lightning impulse current discharge phenomena on carbon-fiber-reinforced plastic (CFRP) laminates. Lightning discharge is a phenomenon in which an extremely intense flash of light and heat is caused by a large electric current flow over a very short period of time; therefore, it is extremely difficult to observe. For this reason, we used a high-speed video camera to visualize the phenomenon at a frame rate of 1 Mfps. In addition, we used Schlieren photography to visualize shock waves propagating from the discharging electrodes. A lightning impulse current generator was used to replicate natural lightning strikes. We used two types of discharging electrodes: a conical electrode and a jet diverting electrode with an insulating sphere. The waveform of the applied lightning impulse current was T1/T2 = 18/55 [μs], and the maximum current was 40 kA.
Keywords :
carbon fibre reinforced plastics; earth electrodes; laminates; lightning; lightning protection; photography; pulse generators; schlieren systems; shock waves; video cameras; CFRP laminate; Schlieren photography; carbon-fiber-reinforced plastic laminate; conical electrode; discharging electrode; electric current flow; high-speed video camera; insulating sphere; jet diverting electrode; light flash; lightning impulse current discharge visualization; lightning impulse current generator; natural lightning strike; shock waves propagating visualization; Electrodes; Heating; Materials; Mirrors; Silicon compounds; Testing; Visualization; CFRP; High-speed camera; Lightning; Schlieren method; Shock wave;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lightning Protection (ICLP), 2014 International Conference o
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/ICLP.2014.6973239
Filename :
6973239
Link To Document :
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