Title :
Comparative study of methyl position effect in poly(methyl) cyclohexyl methacrylates by TSDC and TW
Author :
Espinosa, G.D. ; Sanchis, M.J. ; Diaz-Calleja, R. ; Pagueguy, Claudia ; Argallo, LG ; Radiç, D.
Author_Institution :
Departamento de Termodinamica, Univ. Politecnica de Valencia, Spain
Abstract :
A comparative study of the effect of the position of the methyl group in the cyclohexyl ring in poly (2-methy) cyclohexyl methacrylate (P2MCHM), poly (3-methyl) cyclohexyl methacrylate (P3MCHM) and poly(4-methyl) cyclohexyl methacrylate (P4MCHM) has been carried out by thermally stimulated depolarization currents (TSDC), and thermal windows (TW) measurements. In the TSDC global spectra we appreciate the evolution of the subglass and glass transition absorptions as a function of the position of the methyl group. For each sample fractional polarization is used to describe the fine structure of these complex spectra. By fitting the experimental data to standard models, the kinetic parameters of the relaxations observed have been evaluated. In the glassy state, the complex dielectric permittivity in the frequency domain was calculated at several temperatures from elementary- peaks obtained by partial TSDC curves.
Keywords :
dielectric polarisation; fine structure; glass transition; permittivity; polymer blends; relaxation; thermally stimulated currents; vitreous state; TSDC global spectra; cyclohexyl ring; dielectric permittivity; elementary- peaks; fine structure; fractional polarization; frequency domain; glass transition; glassy state; kinetic parameters; methyl group; methyl position effect; poly (3-methyl) cyclohexyl methacrylate (P3MCHM); poly(4-methyl) cyclohexyl methacrylate (P4MCHM); poly(methyl) cyclohexyl methacrylates; subglass transition; thermal windows measurements; thermally stimulated depolarization current; Absorption; Current measurement; Dielectrics; Frequency domain analysis; Glass; Kinetic theory; Permittivity; Polarization; Position measurement; Windows;
Conference_Titel :
Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
Print_ISBN :
0-7803-8348-6
DOI :
10.1109/ICSD.2004.1350297