DocumentCode :
1721053
Title :
Micro-processing using plasma source ion implantation
Author :
Theodore, Nimel ; Wu, Ling Ling ; Sinclair, Charles ; Siggins, Timothy ; Manos, Dennis
Author_Institution :
Coll. of William & Mary, Williamsburg, VA, USA
fYear :
2001
fDate :
6/23/1905 12:00:00 AM
Firstpage :
126
Lastpage :
127
Abstract :
Plasma source ion implantation is a viable technique to modify surface properties to achieve desired mechanical, electrical, and optical properties on microscopic surface profiles. Implanting ions into materials has been shown by many to increase surface hardness, reduce friction, and resist corrosion. Preliminary work performed on test electrodes has shown an increase in the suppression of field emission by an order of magnitude from 3 MV/m to 30 MV/m. Processed soda-lime glass slides have demonstrated a dramatic change in optical properties as the index of refraction decreased significantly with light at wavelengths greater than 600 nm. These advantages illustrate the unique capabilities of PSII for micro-processing
Keywords :
corrosion resistance; doping profiles; friction; hardness; integrated circuit technology; ion implantation; micromachining; micromechanical devices; plasma materials processing; surface treatment; 600 nm; PSII; corrosion resistance; electrical properties; field emission suppression; friction; index of refraction; mechanical properties; micro-processing; microscopic surface profiles; optical properties; plasma source ion implantation; processed soda-lime glass slides; surface hardness; surface modification; surface properties; test electrodes; Ion implantation; Mechanical factors; Optical materials; Optical microscopy; Optical refraction; Optical surface waves; Particle beam optics; Plasma properties; Plasma sources; Stimulated emission;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 2001. Proceedings of the Fourteenth Biennial
Conference_Location :
Richmond, VA
ISSN :
0749-6877
Print_ISBN :
0-7803-6691-3
Type :
conf
DOI :
10.1109/UGIM.2001.960312
Filename :
960312
Link To Document :
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