• DocumentCode
    172108
  • Title

    Influence of ground wire protection angle on upward leader from 110–1000 kV AC lines

  • Author

    Xi Wang ; Jinliang He ; Zhanqing Yu ; Rong Zeng ; Xiaoli Shen

  • Author_Institution
    Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
  • fYear
    2014
  • fDate
    11-18 Oct. 2014
  • Firstpage
    1128
  • Lastpage
    1133
  • Abstract
    The problem of upward leader inception from transmission lines in lightning shielding failure is still not well understood, essentially because the upward leader emerging from transmission lines is difficult to be captured under natural circumstances. Previous studies have mainly focused on reduced-scale experiments or single-phase test lines. In this context, a real-size experimental system aimed at studying upward leader characteristics on both phase conductor and ground wire is designed, where an ac voltage and an impulse voltage are respectively applied on the phase conductor and the plate-rod electrode simultaneously. Various experiments targeting 110 kV, 220 kV, 500 kV and 1000 kV ac transmission lines based on long air gap discharge between the plate-rod electrode and phase conductor or ground line, were carried out to study the influence of change of ground wire protection angle on phase conductor regarding upward leader characteristics.
  • Keywords
    air gaps; earth electrodes; failure analysis; lightning protection; power cables; power transmission lines; wires (electric); AC lines; ac voltage; air gap discharge; ground wire protection angle; impulse voltage; lightning shielding failure; phase conductor; plate-rod electrode; real-size experimental system; reduced-scale experiments; single-phase test lines; transmission lines; upward leader inception problem; voltage 110 kV to 1000 kV; Analytical models; Conductors; Electrodes; Lead; Wires; Upward leader; ac transmission line; leader development velocity; simulation experiment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lightning Protection (ICLP), 2014 International Conference o
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ICLP.2014.6973294
  • Filename
    6973294