Title :
Computation of capacitance matrix of integrated-circuit interconnects using on-surface MEI method
Author :
Liu, Y.W. ; Lan, K. ; Mei, K.K.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Japan
fDate :
11/1/1999 12:00:00 AM
Abstract :
The on-surface MEI (OSMEI) method is successfully developed to compute the capacitance matrix of integrated-circuit interconnects. The OSMEI method uses the same mesh as MoM, but generates highly sparse matrices. The approach is verified by 2-D and 3-D examples with computing errors within 2~4 percent
Keywords :
MMIC; capacitance; integrated circuit interconnections; sparse matrices; IC interconnects; MMIC; capacitance matrix; highly sparse matrices; on-surface MEI method; Capacitance; Conductors; Coupling circuits; Equations; Integrated circuit interconnections; LAN interconnection; Mesh generation; Message-oriented middleware; Sparse matrices; Strips;
Conference_Titel :
Microwave Conference, 1999 Asia Pacific
Print_ISBN :
0-7803-5761-2
DOI :
10.1109/APMC.1999.829892
