DocumentCode
1721268
Title
Test structures for investigation of metal coverage effects on MOSFET matching
Author
Tuinhout, H.P. ; Vertregt, Maarten
Author_Institution
Philips Res. Lab., Eindhoven, Netherlands
fYear
1997
Firstpage
179
Lastpage
183
Abstract
An extensive set of test structures for characterization of effects of metal coverage on MOSFET matching is presented. These structures prove very useful for evaluation of MOSFET mismatch effects associated with interface states and local mechanical stress differences caused by metal lines running over matched pairs. Better understanding and control of these effects is extremely important for improving advanced mixed signal ICs in modern Multi Level Metal CMOS processes
Keywords
MOSFET; semiconductor device metallisation; semiconductor device testing; MOSFET matching; interface states; mechanical stress; metal coverage; mismatch; mixed signal IC; multi level metal CMOS process; test structure; Analog circuits; CMOS integrated circuits; CMOS process; Converters; Interface states; MOSFET circuits; Modems; Signal processing; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-3243-1
Type
conf
DOI
10.1109/ICMTS.1997.589386
Filename
589386
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