• DocumentCode
    1721268
  • Title

    Test structures for investigation of metal coverage effects on MOSFET matching

  • Author

    Tuinhout, H.P. ; Vertregt, Maarten

  • Author_Institution
    Philips Res. Lab., Eindhoven, Netherlands
  • fYear
    1997
  • Firstpage
    179
  • Lastpage
    183
  • Abstract
    An extensive set of test structures for characterization of effects of metal coverage on MOSFET matching is presented. These structures prove very useful for evaluation of MOSFET mismatch effects associated with interface states and local mechanical stress differences caused by metal lines running over matched pairs. Better understanding and control of these effects is extremely important for improving advanced mixed signal ICs in modern Multi Level Metal CMOS processes
  • Keywords
    MOSFET; semiconductor device metallisation; semiconductor device testing; MOSFET matching; interface states; mechanical stress; metal coverage; mismatch; mixed signal IC; multi level metal CMOS process; test structure; Analog circuits; CMOS integrated circuits; CMOS process; Converters; Interface states; MOSFET circuits; Modems; Signal processing; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-3243-1
  • Type

    conf

  • DOI
    10.1109/ICMTS.1997.589386
  • Filename
    589386