• DocumentCode
    1721357
  • Title

    Fabrication of polysilicon surface micromachined MEMS structures

  • Author

    Munger, Kevin ; Fuller, Lynn F.

  • Author_Institution
    Rochester Inst. of Technol., NY, USA
  • fYear
    2001
  • fDate
    6/23/1905 12:00:00 AM
  • Firstpage
    163
  • Lastpage
    166
  • Abstract
    Polysilicon structures such as cantilevers with electrostatic actuators, mirrors, comb drives, and heaters were fabricated using a surface micromachined process. The fabrication process included 8 photo levels, two LPCVD nitride layers and four polysilicon layers. Details such as the incorporation of etch stops, deposition at higher than normal temperatures to reduce deposition times and anisotropic etch chemistry are important for the successful fabrication of these structures. Measurements were made throughout the fabrication process and pictures were taken at several points in the process. The completed wafers were tested and actuator structures were videotaped
  • Keywords
    chemical vapour deposition; electrostatic actuators; elemental semiconductors; etching; heating elements; micro-optics; micromachining; micromechanical devices; mirrors; photolithography; semiconductor device measurement; silicon; LPCVD nitride layers; Si; Si3N4; actuator structures; anisotropic etch chemistry; cantilevers; comb drives; deposition temperature; deposition times; electrostatic actuators; etch stops; fabrication process; heaters; mirrors; photo levels; polysilicon layers; polysilicon structures; polysilicon surface micromachined MEMS structures; structure measurements; surface micromachined process; videotaping; wafer testing; Aluminum; Dry etching; Fabrication; Micromechanical devices; Plasma applications; Resists; Sputter etching; Strips; Thickness measurement; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 2001. Proceedings of the Fourteenth Biennial
  • Conference_Location
    Richmond, VA
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-6691-3
  • Type

    conf

  • DOI
    10.1109/UGIM.2001.960322
  • Filename
    960322