Three-dimensional RF amplifier using mixed technologies

This paper describes the realization of novel three-dimensional radio frequency amplifiers using mixed technologies. Bare die of high-performance technologies are flip-attached on MCM substrate of either Silicon or Ceramic-based. In this approach, performance can be maximized while cost is minimized. In addition, most matching circuits can be realized or mounted on MCM substrate. Furthermore, customized flexible bare die can be pre-fabricated and designed or matched for different operating frequencies. Two RF amplifiers will be presented. Both were realized using the same bare die but were matched and operated at different frequencies