• DocumentCode
    1721400
  • Title

    Correlation between space charge development and breakdown in polymeric insulation under dc field

  • Author

    Dakka, M. Abou ; Bulinski, A. ; Bamji, S.

  • Author_Institution
    Nat. Res. Council of Canada, Ottawa, Ont., Canada
  • Volume
    1
  • fYear
    2004
  • Firstpage
    166
  • Abstract
    The correlation between space charge accumulation and insulation failure has been investigated in two types of cross-linked polyethylene and ethylenepropylene rubber subjected to a positive DC field of 50 kV/mm for periods up to 3% years. One type of XLPE films was equipped with tree-retardant additives. A buildup of space charge in the films was monitored periodically during aging with Thermal Step Method, which measures space charge distributions under no voltage condition. Not a single parameter that would consistently correlate with times to insulation failure could be derived from the space charge measurements. However, the space charge density peaks that appeared initially near the electrodes moved closer towards one another during aging and the area under the space charge density peaks showed a noticeable increase shortly before insulation breakdown. These observed properties of the material behavior under dc fields could be used to screen new materials for practical applications.
  • Keywords
    XLPE insulation; electric breakdown; polymer insulators; space charge; Thermal Step Method; XLPE films; breakdown; cross-linked polyethylene; dc field; electrodes; ethylene- propylene rubber; insulation failure; polymeric insulation; space charge density peaks; space charge development; space charge distributions; Aging; Charge measurement; Current measurement; Electric breakdown; Plastic insulation; Polyethylene; Polymers; Rubber; Space charge; Trees - insulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
  • Print_ISBN
    0-7803-8348-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2004.1350316
  • Filename
    1350316