DocumentCode
1721403
Title
Modeling a network of MEMS fabrication sites
Author
Benard, William L. ; Huff, Michael A.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2001
fDate
6/23/1905 12:00:00 AM
Firstpage
171
Lastpage
178
Abstract
The MEMS Exchange is a network of MEMS fabrication facilities, wherein wafers are allowed to be processed at multiple sites to provide customers with access to an extremely diverse set of processing capabilities in a very flexible manner. This framework for fabrication of MEMS devices is an instance of a new manufacturing paradigm, which is capable of delivering mass product customization. In two and half years of operation, the MEMS Exchange has completed over 160 custom runs. Data is captured as part of the course of routine MEMS Exchange operations. This data forms the foundation for the models being developed for due date estimation and system capacity management. A discrete event simulation has been written to model fab behavior for varying load and staff availability. This simulator is being used to establish an optimal scheduling algorithm for the manufacturing nodes in order to maximize the network throughput
Keywords
discrete event simulation; flexible manufacturing systems; manufacturing resources planning; micromachining; micromechanical devices; production control; semiconductor process modelling; MEMS Exchange; MEMS Exchange operations; MEMS device fabrication framework; MEMS fabrication facilities; MEMS fabrication site network modeling; data capture; discrete event simulation; due date estimation; fab behavior modeling; manufacturing nodes; manufacturing paradigm; mass product customization; multiple sites; network throughput; optimal scheduling algorithm; processing capabilities; staff availability; system capacity management; wafer processing; Discrete event simulation; Fabrication; Microelectromechanical devices; Micromechanical devices; Optimal scheduling; Product customization; Scheduling algorithm; Semiconductor device modeling; Throughput; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
University/Government/Industry Microelectronics Symposium, 2001. Proceedings of the Fourteenth Biennial
Conference_Location
Richmond, VA
ISSN
0749-6877
Print_ISBN
0-7803-6691-3
Type
conf
DOI
10.1109/UGIM.2001.960324
Filename
960324
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