Title :
A simplified method for high-power MMIC thermal simulation
Author :
Bao, M.J. ; Ooi, B.-L. ; Kooi, P.S. ; Li, L.W. ; Leong, M.S. ; Zhou, X.D. ; Xu, Q.J.
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
fDate :
11/1/1999 12:00:00 AM
Abstract :
The temperature distribution of multiple heat-sources in materials with temperature dependent thermal conductivity has been derived. The method involves the application of the Kirchhoff transformation, the method of images, the adaptive method and the inverse Kirchhoff transformation. The agreement between this method and the accurate direct method is within 1%, and the computation time is much less than the traditional method
Keywords :
MMIC; circuit simulation; integrated circuit modelling; power integrated circuits; temperature distribution; thermal analysis; thermal conductivity; Kirchhoff transformation; MMIC thermal simulation; adaptive method; computation time reduction; high-power MMIC; inverse Kirchhoff transformation; method of images; multiple heat-sources; temperature dependent thermal conductivity; temperature distribution; Circuit simulation; Conducting materials; Interpolation; Kelvin; MMICs; Ohmic contacts; Power amplifiers; Silicon; Temperature distribution; Thermal conductivity;
Conference_Titel :
Microwave Conference, 1999 Asia Pacific
Print_ISBN :
0-7803-5761-2
DOI :
10.1109/APMC.1999.829921
