Fabrication and wafer-level packaging of Si electrostatic microgripper for micro assembly

The wafer-level packaging of an electrostatic Si microgripper was investigated. It is important to ensure safe handling and freedom from damage during fabrication and assembly of micro devices. Some reliability problems have occurred during packaging or handling of the microgripper, regardless of actuation principles. After pre-release of the sacrificial layer, a new wafer-level packaging was processed by anodic bonding between a glass wafer with through-holes and a Si wafer device. A laser dicing has been performed before wire bonding for freedom from damage during both dicing and packaging processes. After the laser dicing, post-releasing has been done. The diced chips were actuated by applied voltage from 0 V_dc to 15 V_dc. The jaws of the fabricated microgripper have been actuated from 0 μm to 25 μm.