Wafer level self-assembly of microstructures using the global magnetic lifting and localized induction welding

This study has successfully demonstrated a process to localize assembly and weld microstructures using an external magnetic field. The primary three merits of this technology are: (1) the magnetic field is used not only to assemble the microstructures but also to fix them by induction welding; (2) the assembly and welding can be localized by the magnetic film; a global wafer level process can also be achieved by the magnetic field; (3) it is easy to tune the heating temperature by varying the area of magnetic film; in other words, the photolithography can define various temperature regions on the substrate.