• DocumentCode
    1722841
  • Title

    Process Tolerant Design Using Thermal and Power-Supply Tolerance in Pipeline Based Circuits

  • Author

    Semião, J. ; Rodríguez-Andina, J.J. ; Vargas, F. ; Santos, M. ; Teixeira, I. ; Teixeira, P.

  • Author_Institution
    Univ. of Algarve, Faro
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper describes a thermal and power-supply tolerant design methodology for pipeline based circuits. It is shown that by making the circuit more tolerant to VDD and temperature (T) instability, even in the presence of process variations, a yield loss reduction is achieved. The goal is to improve signal integrity in the presence of power-supply voltage (VDD) and/or temperature (T) variations, without degrading circuit performance. By using time borrowing techniques, data integrity loss is avoided, and circuit tolerance to VDD and/or temperature variations is enhanced. The methodology is based on a dynamic delay buffer (DDB) block, used to sense VDD/T variations and to induce dynamic clock skews driving a limited subset of key memory elements. Monte Carlo simulations are used to demonstrate that the proposed methodology still holds, even in the presence of process variations.
  • Keywords
    Monte Carlo methods; data integrity; digital circuits; fault tolerance; Monte Carlo simulations; circuit tolerance; data integrity loss; dynamic clock; dynamic delay buffer block; key memory elements; pipeline based circuits; power-supply tolerant design; process tolerant design; thermal tolerance; yield loss reduction; Algorithm design and analysis; Circuit testing; Clocks; Degradation; Delay; Performance analysis; Pipelines; Process design; Temperature; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Diagnostics of Electronic Circuits and Systems, 2008. DDECS 2008. 11th IEEE Workshop on
  • Conference_Location
    Bratislava
  • Print_ISBN
    978-1-4244-2276-0
  • Electronic_ISBN
    978-1-4244-2277-7
  • Type

    conf

  • DOI
    10.1109/DDECS.2008.4538752
  • Filename
    4538752