• DocumentCode
    1722905
  • Title

    High temperature dielectric properties of Apical, Kapton, PEEK, Teflon AF, and Upilex polymers

  • Author

    Hammoud, A.N. ; Baumann, E.D. ; Overton, E. ; Myers, I.T. ; Suthar, J.L. ; Khachen, W. ; Laghari, J.R.

  • Author_Institution
    NASA Lewis Res. Center, Cleveland, OH, USA
  • fYear
    1992
  • Firstpage
    549
  • Lastpage
    554
  • Abstract
    Apical, Upilex, Kapton, Teflon AF, and PEEK polymers are characterized for AC and DC dielectric breakdown in air and in silicone oil at temperatures up to 250°C. The materials are also tested in terms of their dielectric constant and dissipation factor at high temperatures with an electrical stress of 60 Hz, 200 V/mil present. The effects of thermal aging on the properties of the films are determined after 15 h of exposure at 200 and 250°C. The preliminary data indicate that most of the tested films remain relatively stable when exposed to temperature as high as 250°C. The PEEK film however tends to display some wrinkling and exhibit discoloration when exposed to temperatures of about 200°C and higher. All other films displayed good dielectric and physical properties even up to 250°C
  • Keywords
    ageing; dielectric losses; dielectric properties of solids; electric breakdown of solids; organic insulating materials; permittivity; polymer films; thermal stresses; 200 C; 250 C; 60 Hz; Apical; DC dielectric breakdown; DC electrical breakdown; Kapton; PEEK; Teflon AF; Upilex; air; dielectric constant; dielectric properties; discoloration; dissipation factor; effects of thermal aging; high temperatures; polymer films; silicone oil; wrinkling; Aging; Dielectric breakdown; Dielectric constant; Dielectric materials; Displays; Materials testing; Petroleum; Polymers; Temperature; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1992. Annual Report. Conference on
  • Conference_Location
    Victoria, BC
  • Print_ISBN
    0-7803-0565-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.1992.283158
  • Filename
    283158