• DocumentCode
    1722980
  • Title

    Overview of insulating materials system for power cable applications

  • Author

    Jow, Jinder ; Gross, Larry ; Mendelsohn, Alfred ; Aarts, Maarten ; Kjellqvist, Jerker

  • Author_Institution
    Dow Chem. Co., Somerset, NJ, USA
  • Volume
    1
  • fYear
    2004
  • Firstpage
    398
  • Abstract
    A review of solid dielectric insulating materials used for power cable applications is provided. The history of the development of these insulations and their performance differences are discussed. Mechanisms for electrical degradation from bond energies based on thermodynamic and kinetic aspects are proposed. The critical factors contributing to electrical degradation of solid dielectrics under stress include morphological effects, molecular structure, the presence of additives, and the nature of the additives. Differences among these various insulation materials, particularly for polyethylene or ethylene-propylene rubber (primarily filled EPR or EPDM), in these key parameters, as well as differences between different polyethylene structures, are reviewed. A perspective on the future direction for improved insulation materials, and the needs driving these improvements, will also be provided.
  • Keywords
    additives; dielectric materials; ethylene-propylene rubber; ionisation potential; molecular configurations; polyethylene insulation; polymer structure; power cable insulation; reviews; stress effects; surface morphology; EPDM; additive presence; bond energies; critical factors; electrical degradation; ethylene-propylene rubber; kinetic aspects; molecular structure; morphological effects; polyethylene; power cable applications; primarily filled EPR; solid dielectric insulating materials system; stress; thermodynamic aspects; Additives; Bonding; Cable insulation; Degradation; Dielectric materials; Dielectrics and electrical insulation; History; Polyethylene; Power cables; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
  • Print_ISBN
    0-7803-8348-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2004.1350375
  • Filename
    1350375