Title :
The effects of surface plasma treatment on dielectric properties of polyvinylidene fluoride (PVDF) film
Author :
Cygan, P.J. ; Jow, T.R.
Author_Institution :
US Army Electron. Technol. & Devices Lab., Fort, Monmouth, NJ, USA
Abstract :
The effects of CF4, O2, and CF4(96%)-O2(4%) gas plasmas, following exposure for 4 and 16 min, on the dielectric properties of polyvinylidene fluoride (PVDF) films were investigated. No significant changes were observed with the exception of CF4-O2 plasma, where reductions in the breakdown strength (~15%), dielectric constant (6-9%), and electrical conductivity were found. Consistent with the higher content of β phase in a clear film than in a hazy film, higher values of breakdown strength (~9%), dielectric constant (5-15%), and dissipation factor (~20%) were measured for the clear film
Keywords :
dielectric losses; dielectric properties of solids; electric breakdown of solids; electric strength; permittivity; piezoelectric materials; plasma applications; polymer films; surface treatment; 16 min; 4 min; O2 plasma; PVDF film; breakdown strength; clear film; content of β phase; dielectric constant; dielectric properties; dissipation factor; electrical conductivity; hazy film; methane plasma; methane-O2 plasma; piezoelectric; surface plasma treatment; Dielectrics; Electric breakdown; Piezoelectric films; Plasma applications; Plasma chemistry; Plasma materials processing; Plasma properties; Polymer films; Surface contamination; Surface treatment;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1992. Annual Report. Conference on
Conference_Location :
Victoria, BC
Print_ISBN :
0-7803-0565-5
DOI :
10.1109/CEIDP.1992.283160
