Title :
Workflow Simulation for Maintenance Support of Electronic Instrument Based on HLA
Author :
Le, Chen ; Yubo, Chen ; Yongli, Yu ; Liu, Zhang
Author_Institution :
Mech. Eng. Coll., Shijiazhuang
Abstract :
With Object Oriented (OO) method, this paper analyzes the maintenance process of the electronic instrument and its information exchange capability with external environment. Consequently the electronic instrument federate is developed according to High Level Architecture (HLA) standards. This paper develops graphical modeling tool for workflow based on VC++, and creates workflow model for Maintenance Support of Electronic Instrument (MSEI) in this tool based on Petri net. By setting simulating environment, this tool can create simulation models that can be executed in simulation software-ExSpect automatically. Simulate models are integrated into Run-Time Infrastructure (RTI) by ExSpect´s Component Object Model (COM) interfaces. By simulating these instantial workflow models, this paper analyzes the validity, rationality and operational efficiency of MSEI workflow model, and proposes improvement measures for workflow model. Consequently, it carries out Business Process Reengineering (BPR) for maintenance process.
Keywords :
Petri nets; business process re-engineering; computerised instrumentation; maintenance engineering; object-oriented methods; simulation languages; ExSpect component object model; HLA; Petri net; VC++; business process reengineering; electronic instrument maintenance support; graphical modeling tool; high level architecture standard; object oriented method; run-time infrastructure; workflow simulation; Analytical models; Business process re-engineering; Educational institutions; Information analysis; Instruments; Mechanical engineering; Mechanical variables measurement; Object oriented modeling; Runtime; Standards development; BPR; Electronic Instrument; HLA; Maintenance Support; Petri-Net; Workflow;
Conference_Titel :
Electronic Measurement and Instruments, 2007. ICEMI '07. 8th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-1136-8
Electronic_ISBN :
978-1-4244-1136-8
DOI :
10.1109/ICEMI.2007.4350667