• DocumentCode
    172352
  • Title

    Lightning shielding analysis of EHV and UHV AC transmission lines: the effect of operating voltage and terrain topography

  • Author

    Cuaran, J. ; Acosta, J. ; Becerra, M. ; Roman, F.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. Nac. de Colombia, Bogota, Colombia
  • fYear
    2014
  • fDate
    11-18 Oct. 2014
  • Firstpage
    1756
  • Lastpage
    1760
  • Abstract
    The Electrogeometric Method (EGM) is commonly used to analyze and design the external lightning protection of power transmission lines. However, it has been found that the EGM is not able to predict the shielding failure rate observed in EHV and UHV transmission lines. In this article, an analysis of the lightning attachment to EHV and UHV transmission lines is presented, using the Self-consistent Leader Inception and Propagation Model (SLIM). The study is focused on the effect of operating voltage and type of terrain on the estimated lightning attraction distances for overhead transmission lines. It is found that the phase conductors have slightly larger lightning attraction areas during their positive voltage semi cycle and much more over mountainous terrain.
  • Keywords
    failure analysis; lightning protection; power overhead lines; shielding; topography (Earth); EGM; EHV AC transmission line; SLIM; UHV AC transmission line; electrogeometric method; lightning attraction area; lightning attraction distance estimation; lightning shielding analysis; mountainous terrain; operating voltage effect; overhead transmission line; phase conductor; positive voltage semicycle; power transmission line lightning protection; self-consistent leader inception and propagation model; shielding failure rate; terrain topography; Lead; Lightning protection; Silicon; Surfaces; Wires; Leader Inception and Propagation Model; Lightning protection; Transmission Lines; electrogeometric model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lightning Protection (ICLP), 2014 International Conference o
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ICLP.2014.6973413
  • Filename
    6973413