DocumentCode
172363
Title
Modelling proximity effects in transverse magnetic mode for lightning studies
Author
Kumar, Udaya ; Sreeram, Victor
Author_Institution
Dept. of Electr. Eng., Indian Inst. of Sci., Bangalore, India
fYear
2014
fDate
11-18 Oct. 2014
Firstpage
1793
Lastpage
1798
Abstract
Lightning strike to instrumented and communication towers can be a source of electromagnetic disturbance to the system connected. Long cables running on these towers can get significant induction to their sheath/core, which would then couple to the connected equipments. For a quantitative analysis of the situation, suitable theoretical analysis is necessary. Due to the dominance of the transverse magnetic mode during the fast rising portion of the stroke current, which is the period of significant induction, a full wave solution based on Maxwell´s equations is necessary. Owing to the large geometric aspect ratio of tower lattice elements and for feasibility of a numerical solution, the thin-wire formulation for the electric field integral equation is generally adopted. However, the classical thin-wire formulation is not set for handling non-cylindrical conductors like tower lattice elements and the proximity of other conductors. The present work investigates further into a recently proposed method for handling such a situation and optimizes the numerical solution approach.
Keywords
electric field integral equations; lightning protection; numerical analysis; Maxwell equations; communication towers; electric field integral equation; electromagnetic disturbance; full wave solution; lightning strike; lightning studies; modelling proximity effects; noncylindrical conductors; numerical solution; numerical solution approach; quantitative analysis; thin-wire formulation; transverse magnetic mode; Analytical models; Computer aided software engineering; Conductors; Poles and towers; Statistical analysis; Arbitrarily shaped tower elements; Proximity Effect; Thin wire formulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Lightning Protection (ICLP), 2014 International Conference o
Conference_Location
Shanghai
Type
conf
DOI
10.1109/ICLP.2014.6973419
Filename
6973419
Link To Document