DocumentCode :
1723637
Title :
Modeling and simulation of Electrostatic Adhesion for Wall Climbing Robot
Author :
Koh, Keng Huat ; Kuppan Chetty, R.M. ; Ponnambalam, S.G.
Author_Institution :
Sch.. of Eng., Monash Univ. Sunway Campus, Bandar Sunway, Malaysia
fYear :
2011
Firstpage :
2031
Lastpage :
2036
Abstract :
Electrostatic Adhesion (ESA) was chosen as the surface attachment mechanism for Wall Climbing Robot (WCR) for its qualitative advantages. ESA model was developed to account for both parallel-plane and fringing static fields. Such Electrostatic Pad model yields equations governing the ESA force and the geometrical conditions for maximum ESA pressure per pad area. This paper shows that the parameters due to applied voltage, and also geometrical properties, material properties and compliance to wall surface of the Electrostatic Pad do affect the ESA force. The simulation also shows that fringing fields may account up to above 10% of total generated ESA force.
Keywords :
adhesion; electrostatics; mobile robots; robot dynamics; ESA force; ESA model; ESA pressure; electrostatic adhesion; electrostatic pad model; material properties; surface attachment mechanism; wall climbing robots; Adhesives; Electrodes; Electrostatics; Force; Materials; Mathematical model; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Biomimetics (ROBIO), 2011 IEEE International Conference on
Conference_Location :
Karon Beach, Phuket
Print_ISBN :
978-1-4577-2136-6
Type :
conf
DOI :
10.1109/ROBIO.2011.6181590
Filename :
6181590
Link To Document :
بازگشت