• DocumentCode
    1723780
  • Title

    Steep-fronted, single impulse breakdown in epoxy composites with powdered fillers

  • Author

    Budenstein, P.P. ; Song, Y.

  • Author_Institution
    US Army Missile Command, Redstone Arsenal, AL, USA
  • fYear
    1992
  • Firstpage
    208
  • Lastpage
    216
  • Abstract
    Steep-fronted, single impulse breakdown tests have been performed on casting composites having three different compositions, using a uniform field geometry with embedded bruce contour electrodes and gaps of 0.3, 0.6 and 2.2 cm. The binder for each composition contained diglycidyl ether of bisphenol A as the epoxy resin, nadic methyl anhydride as a hardener, and benzyldimethylamine as an accelerator, in the relative proportions by mass of 100:85:0.5. The filler materials are Mg1-xFexSiO3 with x< 0.1, MgTiO3, and BaTi5O11, with dielectric constants of 6, 16, and 50, respectively. The phenomenology of breakdown was similar for the three compositions over the thickness range and conditions of excitation of these tests. Breakdown strength decreased with increasing dielectric constant of the composite and its filler and with increasing gap width
  • Keywords
    composite insulating materials; electric breakdown of solids; electric strength; filled polymers; impulse testing; insulation testing; organic insulating materials; BaTi5O11 filler; Mg1-xFexSiO3 filler; MgTiO3 filler; benzyldimethylamine; breakdown strength; diglycidyl ether of bisphenol A; embedded bruce contour electrodes; epoxy composites; gap width; nadic methyl anhydride; powdered fillers; single impulse breakdown; steep-fronted breakdown; uniform field geometry; Casting; Dielectric constant; Dielectric materials; Electric breakdown; Electrodes; Epoxy resins; Geometry; Impulse testing; Iron; Performance evaluation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1992. Annual Report. Conference on
  • Conference_Location
    Victoria, BC
  • Print_ISBN
    0-7803-0565-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.1992.283186
  • Filename
    283186