• DocumentCode
    1724041
  • Title

    Micropump manufactured by thermoplastic molding

  • Author

    Bustgens, B. ; Bacher, W. ; Menz, W. ; Schomburg, W.K.

  • Author_Institution
    Inst. fur Mikrostrukturtech., Kernforschungszentrum Karlsruhe, Germany
  • fYear
    1994
  • fDate
    6/16/1905 12:00:00 AM
  • Firstpage
    18
  • Lastpage
    21
  • Abstract
    A micromembrane pump was manufactured by combined thermoplastic molding and membrane techniques. Pump cases were made of polyvinylidene fluoride (PVDF) and polysulfone (PSU). The mold insert was milled from a brass substrate. The lateral dimensions of the complete pump are 7 mm×10 mm. The depth and the diameter of the pump chamber are 100 μm and 4 mm, respectively. The pump chamber is covered by a polyimide membrane 2.5 μm thick. The inlet and outlet valves are integrated. The part of the membrane covering the pump chamber is corrugated to reduce the force needed for deflection of the membrane during pumping. The membrane is driven by an integrated thermopneumatic actuator. The air enclosed in an actuator chamber located on top of the membrane is heated by an electric current in a titanium wire. A micromembrane pump made of PSU was driven by short pulses (58 ms) of 15 V at a frequency of 5 Hz. The pump membrane was deflected 100 μm towards the bottom of the pump chamber. The high compression ratio attained with the large membrane deflection allows gases to be pumped. A flow rate of 44 μl/min and a differential pressure of 38 hPa was achieved. The average power consumption of the micropump was 0.45 W
  • Keywords
    membranes; microactuators; micropumps; polymer films; 0.45 W; 10 mm; 100 micron; 15 V; 2.5 micron; 5 Hz; 7 mm; Ti; Ti wire heater; brass substrate; high compression ratio; integrated inlet/outlet valves; integrated thermopneumatic actuator; micromembrane pump; polyimide membrane; polymer pump cases; polysulfone; polyvinylidene fluoride; thermoplastic molding; Actuators; Biomembranes; Current; Manufacturing; Micropumps; Polyimides; Resistance heating; Titanium; Valves; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1994, MEMS '94, Proceedings, IEEE Workshop on
  • Conference_Location
    Oiso
  • Print_ISBN
    0-7803-1833-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1994.555591
  • Filename
    555591