Efficient Estimation of Die-Level Process Parameter Variations via the EM-Algorithm

Author

Zjajo, Amir ; Krishnan, Shaji ; De Gyvez, Jose Pineda

Author_Institution

NXP Semicond. Res., Eindhoven

fYear

2008

Firstpage

1

Lastpage

6

Abstract

A new approach for efficient estimation of die-level process parameter variations based on the expectation- maximization algorithm is proposed. To estimate the parameters and enhance diagnostic analysis, dedicated embedded sensors have been designed. Additionally, to guide the test with the information obtained through monitoring process variations, maximum-likelihood method and adjusted support vector machine classifier is employed. The information acquired is re-used and supplement the circuit calibration. The proposed estimation method is evaluated on a prototype ADC converter with dedicated sensors fabricated in standard single poly, five metal 0.09-mum CMOS.

Keywords

CMOS integrated circuits; analogue-digital conversion; electronic engineering computing; expectation-maximisation algorithm; parameter estimation; support vector machines; ADC converter; CMOS process; circuit calibration; diagnostic analysis; die-level process parameter variation estimation; embedded sensors; expectation-maximization algorithm; maximum-likelihood method; size 0.09 mum; support vector machine classifier; CMOS technology; Circuit testing; Condition monitoring; Crosstalk; Maximum likelihood estimation; Quantization; Signal processing; Support vector machine classification; Support vector machines; Threshold voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Diagnostics of Electronic Circuits and Systems, 2008. DDECS 2008. 11th IEEE Workshop on

Conference_Location

Bratislava

Print_ISBN

978-1-4244-2276-0

Electronic_ISBN

978-1-4244-2277-7

Type

conf

DOI

10.1109/DDECS.2008.4538804

Filename

4538804