• DocumentCode
    1724564
  • Title

    Yield optimization for third party library elements

  • Author

    Bickford, Jeanne Paulette ; Chan, Francis ; Styduhar, Mark ; Wang, Lee ; Arelt, Robert ; Graur, Ioana ; Parker, Steven ; Ryan, Deborah ; Wagner, Tina ; Kumaraswamy, Anand

  • Author_Institution
    IBM Corp. Syst. & Technol. Group, Essex Junction, VT, USA
  • fYear
    2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Optimization of semiconductor product yield requires control of systematic defects. A variety of industry tools are available to check designs for systematic layouts that will be difficult to manufacture. Because of the cost associated with setting up the rules for a checking tool and the cost of licenses needed to evaluate designs, manufacturing process lines typically enable a limited set of tools to evaluate designs for systematic yield sensitivity. Semiconductor product design systems typically incorporate library elements designed by third party design companies. When third party library suppliers do not have access to the licenses or expertise to use the tools selected by the target manufacturing line, a barrier is created to having all library elements in a semiconductor design system checked to the same level. This results in a yield exposure for library elements that are not evaluated and fixed. This paper describes a method used to enable systematic yield evaluation for 32nm library elements procured from third party library suppliers. The third party library supplier provides layout data to the contracting library owner for yield sensitivity analysis. Changes are prioritized and fed back to the third party library supplier. This method interlocks design practices with the third party library supplier and provides a means for the contracting library owner to evaluate third party library elements and provide feedback to optimize the design.
  • Keywords
    circuit optimisation; condition monitoring; fault location; integrated circuit layout; integrated circuit yield; product design; sensitivity analysis; checking tool; industry tools; manufacturing process lines; semiconductor design system; semiconductor product design systems; semiconductor product yield; systematic defects; systematic yield sensitivity; target manufacturing line; third party library elements; yield optimization; yield sensitivity analysis; Application specific integrated circuits; Layout; Libraries; Manufacturing; Metals; Optimization; Systematics; Design for Manufacturing (DfM); Litho Friendly Design (LFD); Manufacturability; Yield; Yield Checking Deck(YCD);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-61284-408-4
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2011.5898163
  • Filename
    5898163