DocumentCode
1724602
Title
Dense and Deformable Motion Extraction in Dynamic Scenes Based on Hierarchical MRF Optimization in RGB-D Images
Author
Wei Wang ; Burschka, Darius
fYear
2015
Firstpage
1115
Lastpage
1122
Abstract
We present a novel hierarchical MRFs optimization method for dense and deformable motion extraction in dynamic scenes. In particular, this hierarchical MRFs structure consists of two layers, the segmentation and the correspondence layer. Firstly, dynamic RGB-D foreground data is segmented through a pixel-level MRF in the segmentation layer. Subsequently, the extracted foreground data is transformed into a 3D point-level MRF in the correspondence layer. A new surface descriptor named deformable color and shape histogram is proposed. It is combined with photometric and geometric features to represent a deformable surface. Finally, the dynamic scene motion is retrieved from correspondences established in the image sequence. Discrete optimization schemes are used for the binary classification and multi-labeling problems. We provide an RGB-D dataset of dynamic scenes, which involves different motion patterns and surface properties of foreground objects. The effectiveness and efficiency of our proposed approach for high accurate foreground segmentation and motion extraction is validated in experiments.
Keywords
feature extraction; image classification; image colour analysis; image motion analysis; image segmentation; image sequences; 3D point-level MRF; RGB-D images; binary classification; deformable color histogram; deformable motion extraction; dynamic RGB-D foreground data; dynamic scene motion; dynamic scenes; geometric features; hierarchical MRF optimization; image sequence; multilabeling problems; photometric features; pixel-level MRF; segmentation layer; shape histogram; surface descriptor; Data mining; Dynamics; Feature extraction; Histograms; Image color analysis; Shape; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Computer Vision (WACV), 2015 IEEE Winter Conference on
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/WACV.2015.153
Filename
7046007
Link To Document