Novel manufacturing and assembly approach to EMI/RFI suppression of high density connectors

A new approach to manufacturing multiple capacitors in a single block of ceramic enables electromagnetic interference (EMI) suppression to be achieved in high density connectors. Ceramic components in either discoidal or tubular form have been extensively used in leadthrough EMI filters for many years. A novel fabrication technology for multilayer ceramic multiway capacitor arrays has been investigated and developed to meet the increasing demand for increased volumetric efficiency. This technology combines the current multilayer capacitor (MLC) processing, with unique design, production and assembly techniques. In addition, this technology significantly reduces the assembly costs associated with the integration of capacitors into connectors and leadthrough components. This paper makes a comparison with existing technologies and describes the novel manufacturing and assembly technology