• DocumentCode
    1725017
  • Title

    Energy efficient modulation for a wireless network-on-chip architecture

  • Author

    DiTomaso, Dominic ; Laha, Soumyasanta ; Kaya, Savas ; Matolak, David ; Kodi, Avinash

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Ohio Univ., Athens, OH, USA
  • fYear
    2012
  • Firstpage
    489
  • Lastpage
    492
  • Abstract
    As both power consumption and leakage currents will limit the scalability of future massively integrated computational systems, research into emerging technologies and devices to replace traditional metallic interconnects has become critical. In this paper we propose an initial implementation for a hybrid wireless network-on-chip (WiNoC) interconnect architecture, named iWISE, for current chip multiprocessors (CMPs). iWISE combines wired interconnects with wireless links that use both frequency and time division multiplexing to offer a balanced, flexible, orthogonal wireless data transfer among cores. We provide a basic description of the iWISE architecture and describe a practical solution for the implementation of wireless interconnects based on an on-off keying (OOK) modulator using ultra-compact Double Gate (DG) CMOS devices. The proposed OOK modulator takes advantage of DG-CMOS devices especially in building compact modulation and tunable amplification circuitry. Real applications from the benchmark suite PARSEC as well as synthetic traffic show an improvement in performance as well as a savings in power.
  • Keywords
    modulation; network-on-chip; radio networks; OOK modulator; benchmark suite PARSEC; compact modulation; current chip multiprocessors; emerging technology; energy efficient modulation; hybrid wireless network on chip interconnect architecture; integrated computational system; leakage currents; metallic interconnects; on-off keying modulator; orthogonal wireless data transfer; power consumption; synthetic traffic; time division multiplexing; tunable amplification circuitry; ultra compact double gate CMOS device; wired interconnects; wireless interconnects; wireless links; Bandwidth; Computer architecture; Integrated circuit interconnections; Modulation; Time frequency analysis; Transceivers; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Circuits and Systems Conference (NEWCAS), 2012 IEEE 10th International
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4673-0857-1
  • Electronic_ISBN
    978-1-4673-0858-8
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2012.6329063
  • Filename
    6329063