DocumentCode
1725025
Title
Predict Malfunction-Prone Modules for Embedded System Using Software Metrics
Author
Yongjie, Lan ; Yong, Qiu ; Meifang, Du
Author_Institution
Shandong Inst. of Bus. & Technol., YanTai
fYear
2007
Abstract
High software dependability is significant for many software systems, especially in embedded system. Dependability is usually measured from the user´s viewpoint in terms of time between failures, according to an operational profile. A software malfunction is defined as a defect in an executable software product that may cause a failure. Thus, malfunctions are attributed to the software modules that cause failures. Developers tend to focus on malfunctions, because they are closely related to the amount of rework necessary to prevent future failures. This paper defined a software module malfunction-prone by class cohesion metrics when there is a high risk that malfunctions will be discovered during operations. Also proposed a novel cohesion measure method for derived classes in embedded system.
Keywords
embedded systems; software metrics; software reliability; class cohesion metrics; cohesion measurement method; embedded systems; software malfunction; software metrics; software module malfunction-prone; Embedded software; Embedded system; Fault diagnosis; Instruments; Software measurement; Software metrics; Software reliability; Software systems; System testing; Time measurement; Embedded System; Malfunction -prone modules; software metrics; software reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Measurement and Instruments, 2007. ICEMI '07. 8th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-1136-8
Electronic_ISBN
978-1-4244-1136-8
Type
conf
DOI
10.1109/ICEMI.2007.4350736
Filename
4350736
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