• DocumentCode
    1725025
  • Title

    Predict Malfunction-Prone Modules for Embedded System Using Software Metrics

  • Author

    Yongjie, Lan ; Yong, Qiu ; Meifang, Du

  • Author_Institution
    Shandong Inst. of Bus. & Technol., YanTai
  • fYear
    2007
  • Abstract
    High software dependability is significant for many software systems, especially in embedded system. Dependability is usually measured from the user´s viewpoint in terms of time between failures, according to an operational profile. A software malfunction is defined as a defect in an executable software product that may cause a failure. Thus, malfunctions are attributed to the software modules that cause failures. Developers tend to focus on malfunctions, because they are closely related to the amount of rework necessary to prevent future failures. This paper defined a software module malfunction-prone by class cohesion metrics when there is a high risk that malfunctions will be discovered during operations. Also proposed a novel cohesion measure method for derived classes in embedded system.
  • Keywords
    embedded systems; software metrics; software reliability; class cohesion metrics; cohesion measurement method; embedded systems; software malfunction; software metrics; software module malfunction-prone; Embedded software; Embedded system; Fault diagnosis; Instruments; Software measurement; Software metrics; Software reliability; Software systems; System testing; Time measurement; Embedded System; Malfunction -prone modules; software metrics; software reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Measurement and Instruments, 2007. ICEMI '07. 8th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-1136-8
  • Electronic_ISBN
    978-1-4244-1136-8
  • Type

    conf

  • DOI
    10.1109/ICEMI.2007.4350736
  • Filename
    4350736