DocumentCode :
1725227
Title :
Virtual metrology models for predicting avera PECVD oxide film thickne
Author :
Ferreira, Ariane ; Roussy, Agnés ; Kernaflen, Christelle ; Gleispach, Dietmar ; Hayderer, Günter ; Gris, Hervé ; Besnard, Jérôme
Author_Institution :
Dept. of Manuf. Scienceand Logistics, Ecole Nat. Super. des Mines de St.-Etienne, Gardanne, France
fYear :
2011
Firstpage :
1
Lastpage :
6
Abstract :
The semiconductor industry is continuously facing four main challenges in film characterization techniques: accuracy, speed, throughput and flexibility. Virtual Metrology (VM), defined as the prediction of metrology variables using process and wafer state information, is able to successfully address these four challenges. VM is understood as definition and application of predictive and corrective mathematical models to specify metrology outputs (physical measurements). These statistical models are based on metrology data and equipment parameters. In this paper, two VM models based on industrial data are presented. The objective of this study is to develop a Model predicting the CVD oxide thickness (average) for an IMD (Inter Metal Dielectric) deposition process using FDC data (Fault Detection and Classification) and metrology data.
Keywords :
dielectric measurement; plasma CVD; semiconductor industry; semiconductor thin films; statistical analysis; thickness measurement; virtual instrumentation; VM model; average PECVD oxide film thickness; corrective mathematical model; equipment parameter; fault detection and classification data; film characterization technique; industrial data; inter metal dielectric deposition process; metrology data; metrology variable; predictive mathematical model; semiconductor industry; statistical model; virtual metrology models; wafer state information; Data models; Films; Mathematical model; Metals; Metrology; Predictive models; Semiconductor device modeling; Advanced Process Control; CVD Oxide thickness; Partial Least Squares Regression; Semiconductor Manufacturing; Tree Ensembles; Virtual Metrology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI
Conference_Location :
Saratoga Springs, NY
ISSN :
1078-8743
Print_ISBN :
978-1-61284-408-4
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2011.5898187
Filename :
5898187
Link To Document :
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