DocumentCode :
172595
Title :
Origin of the deep reset and low variability of pulse-programmed WAl2O3TiWCu CBRAM device
Author :
Belmonte, A. ; Degraeve, Robin ; Fantini, Andrea ; Kim, Wonhee ; Houssa, M. ; Jurczak, Malgorzata ; Goux, L.
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
In this paper we demonstrate for the first time the origin of the deep reset and low switching variability obtained on pulse-programmed (100ns) 90nm-size WAl2O3TiWCuCBRAM device operated at 10 μA. To this aim we develop a Quantum-Point-Contact (QPC) model describing the conduction of the CBRAM states down to deep current levels, allowing to estimate the effective size of the defect particles in the QPC constriction. The model clearly points to smaller particles for CBRAM (Cu particles) as compared to OxRRAM (oxygen-vacancy Vo defects). As a consequence, smaller constrictions (thus larger resistance) may be obtained in CBRAM after reset. In addition, the fluctuation of the number of these small Cu particles in the constriction has lower impact on Random-Telegraph-Noise (RTN), as compared to Vo defects. Finally, the lower switching variability obtained for CBRAM as compared to OxRRAM is also attributed to the larger mobility of Cu ions as compared to Vo particles in Al2O3 medium.
Keywords :
alumina; copper; integrated circuit modelling; particle size; quantum point contacts; random-access storage; titanium compounds; tungsten; OxRRAM; QPC model; RTN; W-Al2O3-TiW-Cu; conductive-bridging random access memory; current 10 muA; deep current levels; deep reset; defect particle size; low switching variability; pulse-programmed CBRAM device; quantum-point-contact model; random-telegraph-noise; size 90 nm; time 100 ns; Adaptation models; Aluminum oxide; Fitting; Fluctuations; Random access memory; Resistance; Switches; CBRAM; Conductive-bridging; ECM; QPC conduction; RTN; deep-reset; switching variability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2014 IEEE 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4799-3594-9
Type :
conf
DOI :
10.1109/IMW.2014.6849356
Filename :
6849356
Link To Document :
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