• DocumentCode
    1726135
  • Title

    A model relating wearout induced physical changes in thin oxides to the statistical description of breakdown

  • Author

    Dumin, D.J. ; Scott, R.S. ; Subramoniam, R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
  • fYear
    1993
  • Firstpage
    285
  • Lastpage
    292
  • Abstract
    A model that relates the physical wearout caused during high voltage or high current stressing of thin oxides to the measured statistical time-dependent dielectric breakdown (TDDB) distributions is discussed. Wearout is described in terms of changes that occurred in the oxide prior to breakdown. Traps are generated within the oxide during wearout and breakdown occurs locally when the local density of traps exceeds a critical value. The model is used to quantify several effects observed during TDDB measurements. The area dependence of breakdown distributions, the differences in the breakdown distributions of constant current stresses and constant voltage stresses and the multimodal distributions often observed are simulated using physically measured quantities and realistic assumptions about the trap distributions inside the oxides. Several TDDB distributions measured by others are fitted using the model developed.<>
  • Keywords
    dielectric thin films; electric breakdown of solids; electron traps; hole traps; semiconductor device models; semiconductor-insulator boundaries; statistical analysis; HV stressing; area dependence; breakdown distributions; constant current stresses; constant voltage stresses; high current stressing; high voltage stressing; local trap density; model; physical wearout; statistical description; thin oxides; time-dependent dielectric breakdown; trap distributions; wearout induced physical changes; Area measurement; Breakdown voltage; Current measurement; Density measurement; Electric breakdown; Electric variables measurement; Semiconductor device breakdown; Semiconductor device measurement; Semiconductor device reliability; Stress measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
  • Conference_Location
    Atlanta, GA, USA
  • Print_ISBN
    0-7803-0782-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.1993.283286
  • Filename
    283286