DocumentCode :
172617
Title :
FRAM sense amplifier with compensation for random and systematic offset
Author :
Glazewski, Robert A. ; Heinrich-Barna, Stephen K. ; Qidwai, Saim A. ; Leisen, Scott L. ; Kraus, William F.
Author_Institution :
Texas Instrum. Inc. Dallas, Dallas, TX, USA
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
Sense Amplifiers have always been an integral part of an embedded memory design and operation. The decreasing process size, appetite for speed, low power, and smaller area all contribute to increased Sense Amplifier (SA) offset. In FRAM technologies, factors such as bitcell scaling, thermal depolarization [2], solder reflow processes [1], and state-dependent imprinting [2] all contribute to decreased signal margin available to the SA. Therefore, increase in SA offset coupled with decrease in signal margin translates into loss of yield and reliability. This paper introduces a modified SA circuit design that through introduction of localized and intentional asymmetrical capacitive loading, on state defining nodes, is shown to reduce the sample sigma and range of the SA´s offset, improving the yield.
Keywords :
amplifiers; compensation; integrated circuit design; integrated circuit reliability; low-power electronics; random-access storage; FRAM sense amplifier; SA offset; asymmetrical capacitive loading; bitcell scaling; embedded memory design; localized asymmetrical capacitive loading; modified SA circuit design; random offset; reliability; sample sigma reduction; signal margin; solder reflow processes; state defining nodes; state-dependent imprinting; systematic offset; thermal depolarization; yield loss; Capacitors; Ferroelectric films; Nonvolatile memory; Random access memory; Silicon; Standards; Systematics; FECAP; FRAM; ferroelectric; nonvolatile memory; offset; sense amplifier; yield;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2014 IEEE 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4799-3594-9
Type :
conf
DOI :
10.1109/IMW.2014.6849368
Filename :
6849368
Link To Document :
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