DocumentCode
172621
Title
From compact model to innovative circuit design of Ag-GeS2 conductive bridge memories
Author
Reyboz, M. ; Jovanovic, N. ; Longnos, F. ; Vianello, E. ; Thomas, O. ; Clermidy, F. ; Molas, G. ; Onkaraiah, S. ; Portal, J.-M. ; Muller, Candice
Author_Institution
LETI, CEA, Grenoble, France
fYear
2014
fDate
18-21 May 2014
Firstpage
1
Lastpage
4
Abstract
CBRAMs are a kind of RRAMs fabricated in the BEOL. They are a promising breakthrough for including permanent retention mechanisms (non-volatility) in embedded systems at low cost. Thus, they are becoming very interesting for the design community. For using this device in innovative circuits, a compact model is mandatory. In this paper, we propose a continuous physical compact model, implemented in Verilog-A and integrated in standard CMOS design. The model is calibrated to device characterization results. Statistical dispersions are taken into account to allow robust design. Comparisons between the model and measurements prove its accuracy and model robustness is validated by circuit design. Finally, the model is used to show the impact of the variability of the switching time in a Non-Volatile Flip-Flop based on CBRAM cells.
Keywords
CMOS memory circuits; bridge circuits; calibration; embedded systems; flip-flops; germanium compounds; hardware description languages; integrated circuit design; integrated circuit modelling; random-access storage; silver; statistical analysis; Ag-GeS2; BEOL; CBRAM cell; RRAM; Verilog-A implementation; calibration; circuit design; conductive bridge random access memory; continuous physical compact model; embedded system; nonvolatile flip-flop; permanent retention mechanism; standard CMOS design; statistical dispersion; Flip-flops; Integrated circuit modeling; Mathematical model; Resistance; Semiconductor device modeling; Switches; Voltage measurement; CBRAM; Non-Volatile Flip-Flop; Verilog-A; compact model; resistive memory; statistical dispersion;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2014 IEEE 6th International
Conference_Location
Taipei
Print_ISBN
978-1-4799-3594-9
Type
conf
DOI
10.1109/IMW.2014.6849371
Filename
6849371
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