• DocumentCode
    172623
  • Title

    Reliability issues studied in Solid-State Drives

  • Author

    Pon, Harry Q. ; Dayacap, Justin R. ; Frickey, Robert E. ; Gogineni, Sivaprasad ; Joseph, Paul Faris ; Lin, Eric S. ; Pon, Florence R. ; Slattery, James P.

  • Author_Institution
    Non-Volatile Memory Solutions Group, Intel Corp., Folsom, CA, USA
  • fYear
    2014
  • fDate
    18-21 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Solid-State Drives (SSDs) have impacted the computing platform and storage industry by providing substantially higher bandwidth random and sequential read write performance compared to Hard Disk Drives (HDDs). Due to these storage performance benefits, SSDs have also demanded more and stressed the NAND components beyond the typical usage models of removable storage media. In this work, several key SSD and NAND component reliability issues as the result of extra performance demands are examined in their respective forms. These include the effects of drive cycling with associated temperature bake, NAND component read disturb, NAND “XOR” (internal RAID), and SSD mechanical reliability issues. Data and results from these respective SSD reliability areas will be presented and discussed.
  • Keywords
    NAND circuits; disc drives; hard discs; reliability; HDD; NAND XOR; NAND components; SSD; computing platform; drive cycling; hard disk drives; internal RAID; mechanical reliability issues; read disturb; removable storage media; sequential read write performance; solid-state drives; storage industry; storage performance benefits; temperature bake; usage models; Drives; Flash memories; Industries; Lithography; Reliability engineering; Robustness; BGA; Drive IOPS Temperature Cycling; ECC; M.2; MLC; NAND; NAND Read Disturb; NGFF; PCB; RAID; Retention; SJR; SLC; SMT; SRO; SSD; Solid-State Drive; TLC; XOR;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2014 IEEE 6th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4799-3594-9
  • Type

    conf

  • DOI
    10.1109/IMW.2014.6849373
  • Filename
    6849373