DocumentCode
1726266
Title
Process reliability development for nonvolatile memories
Author
Dunn, Christopher ; Hefley, P. ; Pope, Simon ; Chong, Darrel ; Desai, Shaishav ; Patel, Pragati ; Baker, Dannon ; Dolby, D. ; Strauss, Tobias ; Gunturi, Sarma ; Wright, Paul ; Sudak, P.
Author_Institution
Texas Instrum. Inc., Houston, TX, USA
fYear
1993
Firstpage
133
Lastpage
146
Abstract
Reliability development during the process design of 0.8- mu m and 1.0- mu m nonvolatile memory technology is discussed. The process development of the passivation system, the polysilicon layer, and the gate oxide are all analyzed. Passivation reliability in terms of data retention, humidity performance, and erasability is presented for various passivation options. A new failure mechanism associated with electronic emission from poly residue is highlighted, and the poly process optimization to eliminate this mechanism is shown. The effect of reoxidized nitrided dielectrics on hot carrier minimization is also evaluated, and the optimal nitridation are reoxidation conditions to achieve hot carrier immunity are presented.<>
Keywords
EPROM; circuit reliability; environmental degradation; failure analysis; hot carriers; integrated circuit technology; integrated memory circuits; nitridation; oxidation; passivation; 0.8 micron; 1 micron; EPROM; Si; data retention; electronic emission; erasability; failure mechanism; gate oxide; hot carrier immunity; hot carrier minimization; humidity performance; nonvolatile memories; optimal nitridation; optimal reoxidation; passivation system; polysilicon layer; process design; process reliability; reoxidized nitrided dielectrics; Dielectric losses; Etching; Failure analysis; Flash memory; Hot carriers; Humidity; Instruments; Nonvolatile memory; Passivation; Process design;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-0782-8
Type
conf
DOI
10.1109/RELPHY.1993.283290
Filename
283290
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