Title :
Investigation of short circuit caused by reduction of PbO sealing glass used for VLSI package
Author :
Sato, Keiichi ; Okinaga, Takayuki ; Kohara, Tetsuji ; Ota, Tadaaki ; Otsuka, Kanji ; Honda, Atsushi ; Mizuno, Chouichirou
Author_Institution :
Hitachi VLSI Eng. Corp., Tokyo, Japan
Abstract :
During the development of a high power dissipating package for VLSI, a serious short circuit was discovered in the test manufacturing sample. The package was constructed with a combination of conventional packaging materials such as ceramic base, PbO sealing glass, molybdenum heat-sink, and aluminum evaporated lead frame. It was found that PbO in the sealing glass was reduced by hydrogen out-gassed from the molybdenum heat-sink of the package.<>
Keywords :
VLSI; circuit reliability; packaging; reduction (chemical); seals (stoppers); short-circuit currents; H outgassing; Mo heat sink; PbO-SiO/sub 2/ sealing glass; QFP; VLSI package; high power dissipating package; reduction; short circuit; Aluminum; Ceramics; Circuit testing; Cogeneration; Glass; Lead; Manufacturing; Packaging; Sealing materials; Very large scale integration;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283294
