Reliability, yield and quality correlation for a particular failure mechanism

Two evaluations, which for one particular failure mode and mechanism show a strong relationship between yield, quality, and reliability on two CMOS processes, are described. The author does not attempt to model the findings but instead points out that an apparently linear relationship exists, and that results from the relationship can be extremely effective when used as a screen to prevent an unreliable or potentially unreliable product from reaching the field. The author also studies the field failure data for these processes, which indicate that the highest incidence of failures occurs for the failure mechanism highlighted during the evaluations. These results, if followed to their logical conclusion, could provide an excellent screen for improving product quality while simultaneously reducing field failures to a minimum for this particular failure mechanism.<>