Title :
Design acceleration of embedded RF inductors on a multilayer flip chip package substrate
Author :
Kamgaing, Telesphor ; Elsherbini, Adel ; Rao, Valluri
Author_Institution :
Components Res., Intel Corp., Chandler, AZ, USA
Abstract :
The electrical performance and the design challenges associated with radio frequency inductors on advanced multilayer package substrates are evaluated. First, new macro-models are developed and can be used to optimize the performance of RF components under process design rules constraints. Then, a novel scalable compact model that utilizes only frequency independent RLC components is introduced. This model is able to represent non linear frequency dependent effects such as skin effect and internal inductance. This compact model is validated using on-package measurements and also used to design a simple RF low pass filter.
Keywords :
RLC circuits; flip-chip devices; inductors; low-pass filters; multilayers; skin effect; RF low pass filter; embedded RF inductors; frequency independent RLC components; internal inductance; multilayer flip chip package substrate; nonlinear frequency dependent effects; on-package measurements; radio frequency inductors; scalable compact model; skin effect; Computational modeling; Inductance; Inductors; Integrated circuit modeling; Solid modeling; Spirals; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898503
