• DocumentCode
    1726628
  • Title

    3D-Resurf: The integration of a p-channel LDMOS in a standard CMOS process

  • Author

    Vescoli, V. ; Park, J.M. ; Carniello, S. ; Minixhofer, R.

  • Author_Institution
    austriamicrosystems AG, Unterpremstatten
  • fYear
    2008
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    This paper presents an isolated high voltage (HV) p- channel lateral double diffused MOS (LDMOS) transistor integrated in a commercial 0.35mum CMOS process without any additional mask or implant steps and thus without increasing process complexity. It is shown that by the introduction of carefully controlled PWELL stripes in the drift region, an increase in breakdown voltages (VB) of LDMOS transistors from 10 to up to 25 V can be achieved. For the huge field of power management and automotive applications this approach of integration allows optimization for multiple voltage domains and guarantees high quality levels at an economical price level.
  • Keywords
    CMOS integrated circuits; MOSFET; electric breakdown; masks; power integrated circuits; 3D-resurf; CMOS process; PWELL stripes; breakdown voltages; high voltage p-channel lateral double diffused MOS transistor; mask; multiple voltage domains; p-channel LDMOS; power management; Automotive applications; CMOS integrated circuits; CMOS process; Energy management; Implants; MOSFETs; Power generation economics; Power semiconductor devices; Quality management; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1532-8
  • Electronic_ISBN
    978-1-4244-1533-5
  • Type

    conf

  • DOI
    10.1109/ISPSD.2008.4538913
  • Filename
    4538913