DocumentCode
1726628
Title
3D-Resurf: The integration of a p-channel LDMOS in a standard CMOS process
Author
Vescoli, V. ; Park, J.M. ; Carniello, S. ; Minixhofer, R.
Author_Institution
austriamicrosystems AG, Unterpremstatten
fYear
2008
Firstpage
123
Lastpage
126
Abstract
This paper presents an isolated high voltage (HV) p- channel lateral double diffused MOS (LDMOS) transistor integrated in a commercial 0.35mum CMOS process without any additional mask or implant steps and thus without increasing process complexity. It is shown that by the introduction of carefully controlled PWELL stripes in the drift region, an increase in breakdown voltages (VB) of LDMOS transistors from 10 to up to 25 V can be achieved. For the huge field of power management and automotive applications this approach of integration allows optimization for multiple voltage domains and guarantees high quality levels at an economical price level.
Keywords
CMOS integrated circuits; MOSFET; electric breakdown; masks; power integrated circuits; 3D-resurf; CMOS process; PWELL stripes; breakdown voltages; high voltage p-channel lateral double diffused MOS transistor; mask; multiple voltage domains; p-channel LDMOS; power management; Automotive applications; CMOS integrated circuits; CMOS process; Energy management; Implants; MOSFETs; Power generation economics; Power semiconductor devices; Quality management; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
978-1-4244-1532-8
Electronic_ISBN
978-1-4244-1533-5
Type
conf
DOI
10.1109/ISPSD.2008.4538913
Filename
4538913
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