Thin film nano thermocouple sensors for applications in laser and electron beam irradiation

Author

Dachen Chu ; Bilir, D.T. ; Pease, R.F.W. ; Goodson, K.E.

Author_Institution

Integrated Circuits Lab., Stanford Univ., CA, USA

Volume

2

fYear

2003

Firstpage

1112

Abstract

The continuous shrinking of transistors in VLSI circuits requires thermometry with high spatial, temporal and thermal resolution. Thin film thermocouple sensors have the potential to achieve small sensing volumes and junction areas. Gold/nickel thin film thermocouples with minimum junction size of (100 nm)/sup 2/ have been fabricated and characterized. While the smaller sensors improve spatial and temporal resolution, the data show reductions in the Seebeck coefficient (temperature sensitivity) and a larger influence of noise. These thin film thermocouples are used to determine the temperature profile of solid-state structures subjected to laser and electron beam irradiation.

Keywords

Seebeck effect; electron beam effects; gold; laser beam effects; nanotechnology; nickel; temperature sensors; thermocouples; Au-Ni; Seebeck coefficient; VLSI circuits; electron beam irradiation; gold-nickel thin film thermocouples; laser beam irradiation; solid-state structures; spatial resolution; temperature sensitivity; temporal resolution; thermal resolution; thermometry; thin film nano thermocouple sensors; transistors; Electron beams; Laser applications; Sensor phenomena and characterization; Spatial resolution; Temperature sensors; Thermal sensors; Thin film circuits; Thin film sensors; Transistors; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1216964

Filename

1216964