Title :
Proceedings of IEEE International Reliability Physics Symposium
Keywords :
circuit reliability; failure analysis; hot carriers; integrated circuit technology; metallisation; optoelectronic devices; reliability; semiconductor devices; ESD; assembly; building-in reliability; channel hot carriers; compound semiconductors; devices; dielectrics; failure analysis; metallization; optoelectronics; processes;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283313
