Title :
Novel failure modes with overmolded printed circuit board-based surface mount packages
Author :
Duffalo, Joseph M. ; Erhart, David L. ; Schmok, Shari C.
Author_Institution :
Motorola Inc., Chandler, AZ, USA
Abstract :
Several failure modes observed during reliability stress testing of a new generation of printed-circuit-board-based surface mounted packages are discussed. When compared with conventional plastic quad flat pack packages these failure modes are shown to be a direct result of the introduction of new material interfaces, and thermal expansion mismatches. If the PCB-based packages are compared to conventional plastic quad flat pack packages during the early stages of package design and process development, then PCB-based packages are comparable in risk. Improvements for addressing these failure modes are presented.<>
Keywords :
circuit reliability; failure analysis; life testing; packaging; printed circuit testing; surface mount technology; thermal expansion; failure modes; material interfaces; overmoulded PCB-based SMT packages; package design; reliability stress testing; thermal expansion mismatches; Assembly; Electronics packaging; Integrated circuit packaging; Lead; Moisture; Plastic integrated circuit packaging; Plastic packaging; Printed circuits; Stress; Testing;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283317
