Novel failure modes with overmolded printed circuit board-based surface mount packages

Author

Duffalo, Joseph M. ; Erhart, David L. ; Schmok, Shari C.

Author_Institution

Motorola Inc., Chandler, AZ, USA

fYear

1993

Firstpage

250

Lastpage

254

Abstract

Several failure modes observed during reliability stress testing of a new generation of printed-circuit-board-based surface mounted packages are discussed. When compared with conventional plastic quad flat pack packages these failure modes are shown to be a direct result of the introduction of new material interfaces, and thermal expansion mismatches. If the PCB-based packages are compared to conventional plastic quad flat pack packages during the early stages of package design and process development, then PCB-based packages are comparable in risk. Improvements for addressing these failure modes are presented.<>

Keywords

circuit reliability; failure analysis; life testing; packaging; printed circuit testing; surface mount technology; thermal expansion; failure modes; material interfaces; overmoulded PCB-based SMT packages; package design; reliability stress testing; thermal expansion mismatches; Assembly; Electronics packaging; Integrated circuit packaging; Lead; Moisture; Plastic integrated circuit packaging; Plastic packaging; Printed circuits; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1993. 31st Annual Proceedings., International

Conference_Location

Atlanta, GA, USA

Print_ISBN

0-7803-0782-8

Type

conf

DOI

10.1109/RELPHY.1993.283317

Filename

283317