• DocumentCode
    1726992
  • Title

    A hysteresis-free platinum alloy flexure material for improved performance and reliability of MEMS devices

  • Author

    Brazzle, J.D. ; Taylor, W.P. ; Ganesh, B. ; Price, J.J. ; Bernstein, J.J.

  • Author_Institution
    Corning IntelliSense Corp., Wilmington, MA, USA
  • Volume
    2
  • fYear
    2003
  • Firstpage
    1152
  • Abstract
    This work presents the use of a hard platinum alloy (Alloy 851) as a MEMS flexure material. Alloy 851 is the trade name for Pt alloyed with 15% Rh and 6% Ru. This alloy is an ideal spring material, as it combines many desirable properties such as biocompatibility, non-ferromagnetic, extreme corrosion resistance, good electrical and thermal conductivity, high Young´s modulus, high yield strength, and negligible hysteresis and fatigue. Alloy 851 can be exposed to fluorine and chlorine plasmas and wet chemical etches without damage and does not require protective masking, resulting in fewer fabrication steps. Control of stress as a function of deposition parameters, as well as thin-film material characteristics are discussed. The resultant flexures and their mechanical performance as supports for rotating mirror structures are described.
  • Keywords
    Young´s modulus; bending strength; corrosion resistance; electrical conductivity; metallic thin films; micromechanical devices; micromirrors; platinum alloys; reliability; rhodium alloys; ruthenium alloys; sputter etching; thermal conductivity; yield strength; MEMS devices; MEMS flexure material; PtRhRu; Youngs modulus; alloy 851; biocompatibility; chlorine plasma etching; corrosion resistance; deposition function; electrical conductivity; fluorine plasma etching; hard platinum alloy; hysteresis-free platinum alloy flexure material; nonferromagnetic materials; protective masking; reliability; rotating mirror structures; spring material; stress control; thermal conductivity; thin-film material; wet chemical etching; yield strength; Biological materials; Conducting materials; Hysteresis; Materials reliability; Microelectromechanical devices; Micromechanical devices; Platinum alloys; Springs; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1216975
  • Filename
    1216975