DocumentCode :
1726992
Title :
A hysteresis-free platinum alloy flexure material for improved performance and reliability of MEMS devices
Author :
Brazzle, J.D. ; Taylor, W.P. ; Ganesh, B. ; Price, J.J. ; Bernstein, J.J.
Author_Institution :
Corning IntelliSense Corp., Wilmington, MA, USA
Volume :
2
fYear :
2003
Firstpage :
1152
Abstract :
This work presents the use of a hard platinum alloy (Alloy 851) as a MEMS flexure material. Alloy 851 is the trade name for Pt alloyed with 15% Rh and 6% Ru. This alloy is an ideal spring material, as it combines many desirable properties such as biocompatibility, non-ferromagnetic, extreme corrosion resistance, good electrical and thermal conductivity, high Young´s modulus, high yield strength, and negligible hysteresis and fatigue. Alloy 851 can be exposed to fluorine and chlorine plasmas and wet chemical etches without damage and does not require protective masking, resulting in fewer fabrication steps. Control of stress as a function of deposition parameters, as well as thin-film material characteristics are discussed. The resultant flexures and their mechanical performance as supports for rotating mirror structures are described.
Keywords :
Young´s modulus; bending strength; corrosion resistance; electrical conductivity; metallic thin films; micromechanical devices; micromirrors; platinum alloys; reliability; rhodium alloys; ruthenium alloys; sputter etching; thermal conductivity; yield strength; MEMS devices; MEMS flexure material; PtRhRu; Youngs modulus; alloy 851; biocompatibility; chlorine plasma etching; corrosion resistance; deposition function; electrical conductivity; fluorine plasma etching; hard platinum alloy; hysteresis-free platinum alloy flexure material; nonferromagnetic materials; protective masking; reliability; rotating mirror structures; spring material; stress control; thermal conductivity; thin-film material; wet chemical etching; yield strength; Biological materials; Conducting materials; Hysteresis; Materials reliability; Microelectromechanical devices; Micromechanical devices; Platinum alloys; Springs; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
Type :
conf
DOI :
10.1109/SENSOR.2003.1216975
Filename :
1216975
Link To Document :
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