DocumentCode
1726992
Title
A hysteresis-free platinum alloy flexure material for improved performance and reliability of MEMS devices
Author
Brazzle, J.D. ; Taylor, W.P. ; Ganesh, B. ; Price, J.J. ; Bernstein, J.J.
Author_Institution
Corning IntelliSense Corp., Wilmington, MA, USA
Volume
2
fYear
2003
Firstpage
1152
Abstract
This work presents the use of a hard platinum alloy (Alloy 851) as a MEMS flexure material. Alloy 851 is the trade name for Pt alloyed with 15% Rh and 6% Ru. This alloy is an ideal spring material, as it combines many desirable properties such as biocompatibility, non-ferromagnetic, extreme corrosion resistance, good electrical and thermal conductivity, high Young´s modulus, high yield strength, and negligible hysteresis and fatigue. Alloy 851 can be exposed to fluorine and chlorine plasmas and wet chemical etches without damage and does not require protective masking, resulting in fewer fabrication steps. Control of stress as a function of deposition parameters, as well as thin-film material characteristics are discussed. The resultant flexures and their mechanical performance as supports for rotating mirror structures are described.
Keywords
Young´s modulus; bending strength; corrosion resistance; electrical conductivity; metallic thin films; micromechanical devices; micromirrors; platinum alloys; reliability; rhodium alloys; ruthenium alloys; sputter etching; thermal conductivity; yield strength; MEMS devices; MEMS flexure material; PtRhRu; Youngs modulus; alloy 851; biocompatibility; chlorine plasma etching; corrosion resistance; deposition function; electrical conductivity; fluorine plasma etching; hard platinum alloy; hysteresis-free platinum alloy flexure material; nonferromagnetic materials; protective masking; reliability; rotating mirror structures; spring material; stress control; thermal conductivity; thin-film material; wet chemical etching; yield strength; Biological materials; Conducting materials; Hysteresis; Materials reliability; Microelectromechanical devices; Micromechanical devices; Platinum alloys; Springs; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1216975
Filename
1216975
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