Title :
Thermal and Structural Simulation Techniques for Estimating Fatigue Life of an IGBT Module
Author :
Sasaki, Koji ; Iwasa, Naoko ; Kurosu, Toshiki ; Saito, Katsuaki ; Koike, Yoshihiko ; Kamita, Yukio ; Toyoda, Yasushi
Author_Institution :
Mech. Eng. Res. Lab., Hitachi, Ltd., Hitachinaka
Abstract :
Two techniques, one for estimating fatigue life of aluminum bonding wires and one for estimating fatigue life of solders under repeated thermal load, were developed. In one method, fracture mechanics with strain intensity factor (DeltaK epsiv) is used to estimate the fatigue life of aluminum bonding wires. In the other method, "electrical-thermal-structural coupled analysis" is used to estimate fatigue life of solders. The simulated crack propagation in aluminum bonding wires agrees well with the experimentally measured propagation. Moreover, the simulations show that fatigue life of aluminum bonding wires has a lower fatigue limit at a temperature-cycling range of 30degC.
Keywords :
aluminium; bonding processes; fatigue cracks; fracture mechanics; insulated gate bipolar transistors; thermal analysis; wires; IGBT module; aluminum bonding wires; crack propagation simulation; electrical-thermal-structural coupled analysis; fatigue life estimation; fracture mechanics; strain intensity factor; structural simulation; thermal simulation; Aluminum; Bonding; Fatigue; Insulated gate bipolar transistors; Life estimation; Life testing; Temperature distribution; Thermal engineering; Thermal stresses; Wires;
Conference_Titel :
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1532-8
Electronic_ISBN :
978-1-4244-1533-5
DOI :
10.1109/ISPSD.2008.4538928
