Title :
Moisture-induced gold ball bond degradation of polyimide-passivated devices in plastic packages
Author :
Shirley, C. Glenn ; De Guzman, M.S.
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
A mechanism of gold ball bond degradation in plastic packages is discussed. Polyimide die topcoat and moisture stress accelerate bond degradation. The mechanism is further accelerated by mistargeted bonds and low bonding parameters.<>
Keywords :
circuit reliability; gold; lead bonding; life testing; packaging; passivation; Au ball bond; ball bond degradation; bonding parameters; mistargeted bonds; moisture stress; plastic packages; polyimide die topcoat; polyimide-passivated devices; Bonding forces; Degradation; Gold; Humidity; Intermetallic; Plastic packaging; Polyimides; Stress; Testing; Wire;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283321
