DocumentCode
1727171
Title
Thermal cycling reliability of die bonding adhesives
Author
Bjorneklett, A.
fYear
1993
Firstpage
204
Lastpage
208
Abstract
A study of thermal cycling endurance of three different die attach adhesives by measuring the increase in thermal resistance during a thermal cycling test is discussed. Test chips were bonded to three substrates with different coefficients of thermal expansion. The thermal resistance increased with increased number of temperature cycles. A large mismatch in thermal expansion gave the fastest increase in thermal resistance. The study also revealed a significant difference in behavior between the different adhesives.<>
Keywords
adhesion; monolithic integrated circuits; packaging; reliability; thermal expansion; thermal resistance; coefficients of thermal expansion; die attach; die bonding adhesives; mismatch; temperature cycles; thermal cycling endurance; thermal cycling test; thermal resistance; Bonding; Curing; Electrical resistance measurement; Microassembly; Silicon; Temperature; Testing; Thermal expansion; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-0782-8
Type
conf
DOI
10.1109/RELPHY.1993.283323
Filename
283323
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